芯片内/间无线互连技术发展综述  

Summarization of Intra /Inter Chip Wireless Interconnection Technology

作　　者：王宜文[1] 李学华[1] 

机构地区：[1]北京信息科技大学信息与通信工程学院,北京100101

出　　处：《电讯技术》2014年第7期1031-1038,共8页Telecommunication Engineering

基　　金：国家自然科学基金资助项目(61171039);北京市教委科技面上项目(KM201311232009);北京市属高等学校高层次人才引进与培养计划项目(CIT&TCD201404114)~~

摘　　要：为了解决超大规模集成电路布线复杂的问题,无线互连技术(WIT)应运而生。介绍了实现芯片内/间无线互连的两类技术,一类是基于片上天线的无线互连技术,另一类是基于AC耦合的无线互连技术。从实现成本、功耗,传输性能方面对这两类技术进行了分析与比较,讨论了它们的具体应用及适用范围,同时也总结了两者目前存在的问题,并指出了其未来的研究方向,对今后芯片内/间无线互连技术的应用研究具有一定的参考意义。To solve the cpmplex wiring problem of very large scale integrated circuit（ VLSI）, wireless interconnection technology（WIT） emerges as the times require. This paper introduces two techniques to realize intra/inter chip wireless interconnection,namely wireless interconnection technique based on on-chip antennas and wireless interconnection technique extended from AC-coupling. The two major technologies are analyzed and compared in terms of the implementation cost, power consumption, and transmission performance. Their potential application scopes and technical limitations are discussed. The innovative directions in future research are predicted. The content in this paper can provide a reference for future research on the intra/inter chip wireless intereonnection technologies.

关 键 词：芯片内 间无线互连 AC耦合 片上天线 超宽带 综述 

分 类 号：TN803.5[电子电信—信息与通信工程]