Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal  

浸镀Ni对Al/Cu双金属材料界面显微组织及力学性能的影响(英文)

作　　者：赵佳蕾[1] 接金川[1] 陈飞[1] 陈航[1] 李廷举[1] 曹志强[1] 

机构地区：[1]大连理工大学材料科学与工程学院,大连116024

出　　处：《Transactions of Nonferrous Metals Society of China》2014年第6期1659-1665,共7页中国有色金属学报（英文版）

基　　金：Projects (51274054,51375070,51271042) supported by the National Natural Science Foundation of China;Projects (2013M530913) supported by the China Postdoctoral Science Foundation

摘　　要：A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.采用浸镀的方法在纯铝基体上浸镀镍基镀层,然后在450-550℃温度范围内用扩散复合的方法制备Al/Cu双金属材料。用扫描电子显微镜（SEM）和X射线衍射仪（XRD）分别对Al/Cu结合体的界面显微组织以及断裂表面进行表征。用拉伸剪切测试及显微硬度测试对Al/Cu双金属材料的力学性能进行测量。结果表明,Ni中间层可以有效地消除Al—Cu金属间化合物的形成。Al/Ni界面由Al3Ni和Al3Ni2两相组成,而在Ni/Cu界面处则是Ni—Cu固溶体。Ni中间层的加入提高了复层材料的拉伸剪切强度。在500℃制备的添加Ni中间层的试样表现出最大的拉伸剪切值,为34.7 MPa。

关 键 词：Al/Cu bimetal immersion Ni plating INTERFACE diffusion bonding INTERMETALLICS 

分 类 号：TG178[金属学及工艺—金属表面处理]