高均匀长工作深度激光整形系统设计  

High Uniform Long Working Depth Laser Shaping System Design

作　　者：余金清[1] 尹韶云[2] 殷智勇[3] 董小春[1] 孙秀辉[2] 苟健[1] 杜春雷[2] 

机构地区：[1]中国科学院成都光电技术研究所微纳加工实验室,成都610209 [2]中国科学院重庆绿色智能技术研究所微纳制造与系统集成中心,重庆401122 [3]军械工程学院电子与光学工程系,石家庄050003

出　　处：《光电工程》2014年第8期80-84,共5页Opto-Electronic Engineering

基　　金：重庆市科技计划项目(cstc2012ggC90003);国家自然基金项目(11174281;61275061)资助

摘　　要：高功率固体激光器对入射的泵浦光具有严格的均匀性和工作深度要求。本文通过将微透镜阵列与长焦深菲涅尔透镜结合,对半导体激光器阵列光束进行整形,获得在长工作深度范围内的均匀光斑。本文针对dilas E15Y-808.3-1260C半导体激光器阵列设计了目标光斑大小为4 mm×4 mm的三维激光整形系统。仿真结果表明,该光束整形系统与传统的多通道光束积分整形系统相比,在光斑尺寸与均匀性保持不变的情况下,工作深度增加了2倍。High power solid state laser has strict requirements in the incident pump light. This paper reshape the beam of semiconductor laser array to a long working depth high uniform spot by combining microlens array and long focal depth Fresnel lens. A simulation system is designed, the input is from dilas E15Y-808.3-1260C laser array, and the final spot is 4mm ＆#215; 4mm. The result show that compared with conventional system, the working depth is 2 times extended and the uniformity in work depth maintains the same. The design is useful and effective, and provides a feasible way to high power semiconductor laser array pumping source.

关 键 词：光束整形 微透镜阵列 菲涅尔透镜 长焦深 

分 类 号：TN245[电子电信—物理电子学]