带有凸凹微结构的微流控基片热压成形特性研究  

Research on Hot Embossing Process of Microfluidic Substrates with Both Convex and Concave Microstructures

作　　者：张宗波[1] 吴宝贵[1] 贺庆强[1] 罗怡[2] 王晓东[2] 王立鼎[2] 

机构地区：[1]中国石油大学(华东),青岛266580 [2]大连理工大学辽宁省微纳米技术及系统重点实验室,大连116024

出　　处：《中国机械工程》2014年第16期2231-2234,2239,共5页China Mechanical Engineering

基　　金：国家自然科学基金资助项目(51205414);辽宁省微纳米技术及系统重点实验室开放基金资助项目(20110301);中央高校基本科研业务费专项资金资助项目(14CX02070A;12CX04062A);山东省中青年科学家奖励基金资助项目(BS2011ZZ020)

摘　　要：研究了热压法制作带有导能筋的新型凸凹微结构的成形特性。从理论出发对材料的本构关系及其温变特性进行了表征,通过对商用软件的二次开发实现了成形特性理论模型的应用,利用有限元法对带有导能筋的基片的热压过程进行仿真,分析了在压力受到严格限制的情况下热压温度以及保温保压时间对复制精度的影响,在此基础上优化了工艺参数。利用套刻法和各向异性湿法腐蚀技术制得所需的硅模具,进行了热压试验,试验结果验证了仿真结果的有效性。Hot embossing process of the devices with both concave microchannel and convex micro energy director for ultrasonic bonding was researched.Based on the constitutive relation and temperature-depending mechanical properties of the material,commercial software was redeveloped.FEM was employed to simulate the embossing processes with different embossing temperatures.The influences of temperature and holding time on replication accuracy was analyzed with strictly defined embossing force.And the processing parameters were optimized.A silicon mold fabricated by multi-step lithography technology and two times of wet-etching processes was used in the hot embossing experiment.The experiments agree well with the simulation results.

关 键 词：微流控芯片 超声波键合 导能筋 有限元法 

分 类 号：TG453.9[金属学及工艺—焊接]