纳米银粉在低温银浆中的烧结工艺研究  

Sintering process of nano-silver powders in the application in low temperature silver pastes

作　　者：刘文平[1,2] 秦海青[1,2] 林峰[1,2] 雷晓旭[1,2] 张振军[1,2] 

机构地区：[1]中国有色桂林矿产地质研究院有限公司、国家特种矿物材料工程技术研究中心,广西桂林541004 [2]中国有色桂林矿产地质研究院有限公司、广西超硬材料重点实验室,广西桂林541004

出　　处：《电子元件与材料》2014年第9期30-33,共4页Electronic Components And Materials

基　　金：广西科学研究与技术开发计划(科技成果转化与推广计划)资助项目(No.桂科转1298009-15);广西科学研究与技术开发计划(科技创新能力与条件建设计划)资助项目(No.桂科能1270010)

摘　　要：为了在柔性基材上获得导电性良好的导电线路，以直流电弧等离子体蒸发凝聚法制备了纳米银粉，并以其作为导电功能相制备了低温银浆，对其烧结工艺展开了研究。结果表明所制的银粉为一种球形度高、结晶性良好、不同大小纳米颗粒复合的粉体，以其制备的银浆在250～300℃烧结即可形成导电性膜层，且烧结温度越高，所得膜层方阻越低。但烧结温度较高时，需缩短烧结时间，以避免膜层剧烈收缩产生的裂纹降低膜层的导电性。所制银浆经300℃烧结30min所得膜层的导电性最好，方阻可低至8．8mΩ／囗。In order to obtain good conductive lines on flexible substrate, the nano-silver powders were prepared by DC arc plasma evaporation method, which were used as the conductive phase to prepare the low temperature silver paste and their sintering process was studied. The results show that the prepared silver powders are spherical and with good crystallinity, which are composite powders of different sizes nanoparticles. The films have excellent electrical conductivity, when the silver paste prepared by the silver powders is sintered at 250-300℃, and the sheet resistance of the films decreases with the increasing of the sintering temperatures. The sintering time should decrease when the silver paste is sintered at higher temperature, in order to avoid crack due to films shrinkage, which will decrease the electrical conductivity of the films. When the silver paste is sintered at 300 ℃ for 30 min, the obtained films exhibit the best electrical conductivity, which could also delivers a resistance of 8.8mΩ/□.

关 键 词：等离子体 纳米银粉 导电浆料 低温烧结 方阻 柔性基材 

分 类 号：TM241[一般工业技术—材料科学与工程]