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出 处:《Journal of Semiconductors》2014年第9期60-64,共5页半导体学报(英文版)
基 金:Project supported by the National Natural Science Foundation of China(Nos.61376077,61201046,61204081);the Beijing Natural Science Foundation(Nos.4132022,4122005);the Guangdong Strategic Emerging Industry Project of China(No.2012A080304003);the Doctoral Fund of Innovation of Beijing University of Technology
摘 要:The effect of drain-source voltage on A1GaAs/InGaAs PHEMTs thermal resistance is studied by experimental measuring and simulation. The result shows that A1GaAs/InGaAs PHEMTs thermal resistance presents a downward trend under the same power dissipation when the drain-source voltage (VDs) is decreased. Moreover, the relatively low VDS and large drain-source current (IDs) result in a lower thermal resistance. The chip-level and package-level thermal resistance have been extracted by the structure function method. The simulation result indicated that the high electric field occurs at the gate contact where the temperature rise occurs. A relatively low VDS leads to a relatively low electric field, which leads to the decline of the thermal resistance.The effect of drain-source voltage on A1GaAs/InGaAs PHEMTs thermal resistance is studied by experimental measuring and simulation. The result shows that A1GaAs/InGaAs PHEMTs thermal resistance presents a downward trend under the same power dissipation when the drain-source voltage (VDs) is decreased. Moreover, the relatively low VDS and large drain-source current (IDs) result in a lower thermal resistance. The chip-level and package-level thermal resistance have been extracted by the structure function method. The simulation result indicated that the high electric field occurs at the gate contact where the temperature rise occurs. A relatively low VDS leads to a relatively low electric field, which leads to the decline of the thermal resistance.
关 键 词:AIGaAs/InGaAs PHEMTs structure function method thermal resistance drain-source voltage
分 类 号:TN386[电子电信—物理电子学]
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