In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip  

作　　者：王跃林 李铁 张啸 曾鸿江 金钦华 

机构地区：[1]Science and Technology on Micro-System Laboratory, Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences

出　　处：《Journal of Semiconductors》2014年第8期1-9,共9页半导体学报（英文版）

基　　金：Project supported by the National Basic Research Program of China(Nos.2011CB309501,2012CB934102);the National Hi-Tech Researchand Development Program of China(No.SS2012AA040402);the National Science and Technology Supporting Program of China(No.2012BAJ11B01);the Fund for Creative Research of NSFC(No.61321492);the Key Project of NSFC(Nos.91323304,91123037);the FP7-PEOPLE-2010-IRSES Project ECNANOMAN(No.269219);the Shanghai International Sci.&Tech.Cooperation Foundation Project(No.12410707300)

摘　　要：Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope （SEM） and a transmission electron microscope （TEM） with the help of tradi- tional micro-electro-mechanical system （MEMS） technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young＇s modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices.Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope （SEM） and a transmission electron microscope （TEM） with the help of tradi- tional micro-electro-mechanical system （MEMS） technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young＇s modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices.

关 键 词：MEMS NANOSCALE TENSILE in situ TEM/SEM 

分 类 号：TN492[电子电信—微电子学与固体电子学]