Cu-Mg-Te-Y合金退火工艺研究  

Annealing Process of Cu-Mg-Te-Y Alloy

作　　者：韩建宁[1] 陈亮[1] 周秉文[1] 薛彦燕 贾非[1] 张兴国[1] 

机构地区：[1]大连理工大学,辽宁大连116024

出　　处：《稀有金属材料与工程》2014年第8期2038-2042,共5页Rare Metal Materials and Engineering

基　　金：国家自然科学基金资助(50875031);中央高校基本科研业务费专项基金资助(DUT12ZD205)

摘　　要：研究了退火温度和退火时间对冷轧变形后的Cu-Mg-Te-Y合金组织及性能的影响。结果表明：Cu-Mg-Te-Y合金在冷轧变形后,显微组织呈纤维状,内部晶粒取向改变,硬度提高,导电率降低;经过退火处理后,铜合金硬度下降,导电率回升,提高退火温度可明显提高合金伸长率;随退火时间延长,Mg原子从晶格中脱出,通过位错等扩散通道,在Cu2Te相周围偏聚,使导电率提高,但再结晶新晶粒的出现,晶界增多,使导电率降低,综合作用使合金的导电率明显提高;退火温度在360~390℃,退火时间1 h以内时,Cu-Mg-Te-Y合金可以得到最佳的综合性能。Effects of annealing time and temperature on microstructure and properties of cold-rolled Cu-Mg-Te-Y alloy have been studied. The results indicate that after cold rolling, the microstructure presents a fiber texture, the internal grain orientation changes and Vickers hardness increases while electrical conductivity decreases. After annealing treatment, Vickers hardness decreases with electrical conductivity and elongation improved. With the annealing time prolonging, the magnesium as solution atom in copper alloy escapes from copper lattice and segregates around Cu2Te phases through diffusion paths such as dislocations, so electrical conductivity goes up. In turn, electrical conductivity goes down when the grain boundaries become continuously more owing to the recrystallized new grains. Consequently, the optimum overall performance of Cu-Mg-Te-Y alloy is gained under a certain annealing process including annealing temperature of 360-390 ℃ and annealing time within 1 h.

关 键 词：高强高导电 镁碲铜 退火 导电率 维氏硬度 

分 类 号：TG166.2[金属学及工艺—热处理]