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作 者:陈晓[1] 陈磊[1] 姜其斌[1] 李亮亮[1] 杨清[1] 周光红[1]
机构地区:[1]株洲时代新材料科技股份有限公司,湖南株洲412007
出 处:《绝缘材料》2014年第4期41-44,共4页Insulating Materials
摘 要:制备了一种200级有机硅少胶带用胶粘剂,采用GPC、FT-IR、TGA分别考察其分子量与分子量分布、官能团结构及热失重性能,并对胶粘剂的应用性能进行了研究。结果表明:该有机硅胶粘剂与无溶剂有机硅浸渍漆的相容性良好,使用该胶粘剂复合而成的少胶云母带满足应用要求,且应用该少胶带制作的结构线圈与同类进口少胶带制作的结构线圈的性能相当。A kind of adhesive for class 200 silicone dry mica tape was prepared, and its molecular weight and distribution, functional groups structure and thermal property were analyzed by GPC, FT-IR, and TGA, and the application of the adhesive was studied. The results show that the silicone adhesive has good compatibility with the solvent-free silicone impregnating resin. The dry mica tape made by the adhesive can meet the application requirements, and the properties of coil structure made by the dry mi-ca tape are equivalent to that of the coil structure made by the similar imported dry mica tape.
分 类 号:TM215.43[一般工业技术—材料科学与工程]
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