以改进的迈克尔逊干涉仪测量LED封装材料的热膨胀系数  

Measurement of Coefficient of Thermal Expansion of Encapsulation Material in LED Using Michelson Interferometer

作　　者：李相剑 李华祯 郑改革[1] 陈玉林[1] 张成义[1] 

机构地区：[1]南京信息工程大学,江苏南京210044

出　　处：《大学物理实验》2014年第4期3-5,共3页Physical Experiment of College

基　　金：南京信息工程大学本科专业重点建设项目(2013002;2014001)

摘　　要：LED封装材料在封装的过程中由于热膨胀的缘故会产生应力,将对LED的发光效率产生较大影响。改装的迈克尔逊干涉仪用于测量二氧化钛/有机硅复合的LED封装材料在不同温度范围内的热膨胀系数,具有测量准确,分辨率高等优点。LED packaging material can cause stress due to thermal expansion in the packaging process, will have a greater impact on the luminous efficiency of LED. The modified Michelson interferometer is used to measure the thermal expansion coefficient of composite LED packaging material with TiO2 and organic Si in dif-ferent temperature range expansions;it has the advantages of accurate measurement,high resolution.

关 键 词：迈克尔逊干涉仪 热膨胀系数 LED封装材料 

分 类 号：TB133[机械工程—光学工程]