SPS法制备MgO/Cu复合材料抗电蚀性能研究  

Arc Erosion Resistance of MgO /Cu Composites Prepared by SPS

作　　者：王庆福[1,2] 张彦敏[1,2,3] 国秀花[1,2,3,4] 宋克兴[1,2,3] 

机构地区：[1]河南科技大学材料科学与工程学院 [2]河南省有色金属材料科学与加工技术重点实验室 [3]有色金属共性技术河南省协同创新中心 [4]西安理工大学材料科学与工程学院

出　　处：《特种铸造及有色合金》2014年第7期781-784,共4页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(51075122;51345011);河南省杰出人才资助项目(134200510011);河南省科技攻关资助项目(112102210177);教育部创新团队发展计划资助项目(IRT1234)

摘　　要：以纳米级MgO颗粒为增强相，采用SPS法（SparkPlasmaSintering）制备了体积分数为1％、3％、5％、8％的MgO／Cu复合材料，并在JF04C电接触触点材料测试系统上进行了抗电弧侵蚀性能测试。结果表明，随着MgO含量的增加，MgO／Cu复合材料的相对密度和电导率降低，硬度先升高后降低，材料质量转移量逐渐减小，抗电蚀性能逐渐提高，其中MgO含量为5％时，综合性能最好，硬度（HV）达到110，电导率为45．24MS／m，抗电蚀性能转移量为0．1mg。组织观察表明，MgO颗粒含量为1％～5％时，颗粒在基体内分布均匀致密、晶粒细小，触头表面熔化程度逐渐减小，而当MgO含量达到8％时，MgO颗粒在铜基体中出现一定程度的团聚，这也是影响MgO／Cu复合材料综合性能变化的主要原因。MgO/Cu composites with different MgO content such as 1%, 3 %, 5 %, 8 %, were prepared by SPS （spark plasma sintering） method. Influences of different MgO volumetric fraction on density.elec- tric conductivity, hardness and microstructure of the composites prepared were investigated. Arc erosion resistance was tested by JF04C electrical contact material testing system. Experimental results show that with the increase of MgO volumetric fraction, density and electric conductivity are decreased, mean- while, the hardness is increased firstly and then decreased, and the weight loss is decreased and arc ero- sion resistance is improved. With MgO content of 5 %, comprehensive properties of MgO/Cu composites exhibit desirable, where hardness is 110 HV and conductivity is 45.24MS/m with electrical erosion re- sistance of 0.1 mg. The microstructural observation reveals that with MgO content in range of 1% to 5 %, MgO particles are uniformly distributed into the matrix with fine grain and decrease of contact sur- face melting degree. When the MgO volume fraction is 8%, MgO particles in copper matrix present a certain aggregation, leading to the comprehensive performance changes of MgO/Cu composites.

关 键 词：SPS MGO CU复合材料 电导率 硬度 抗电蚀性能 

分 类 号：TB333[一般工业技术—材料科学与工程]