硅对铜胁迫下小麦幼根细胞超微结构的影响  

Effects of silicon on the ultrastructures of wheat radical cells under copper stress

作　　者：张黛静[1] 马建辉[1] 杨淑芳[1] 陈惠婷[1] 刘佩[1] 王文斐[1] 李春喜[1] 

机构地区：[1]河南师范大学生命科学学院,河南新乡453007

出　　处：《应用生态学报》2014年第8期2385-2389,共5页Chinese Journal of Applied Ecology

基　　金："十二五"国家科技支撑计划项目(2013BAD07B07;2012BAD04B07);循环农业科技工程项目(2012BAD14B08)资助

摘　　要：为探索硅对重金属铜胁迫下小麦的缓解作用,以矮抗58为供试材料,采用室内溶液培养法,研究不同浓度重金属铜(0、15、30 mg·L-1)胁迫及铜胁迫下添加外源硅(50mg·L-1)对小麦幼苗生长、根系活力及根尖超微结构的影响.结果表明:铜处理下,小麦幼苗根长、株高和根系活力均极显著低于对照(P<0.01),加硅处理后小麦根长、株高和根系活力与单一铜处理相比均有所提高.铜胁迫下,小麦根尖细胞壁和细胞膜均遭到不同程度的破坏,细胞间空隙加大、细胞器消失;加硅处理后,虽然与对照相比,部分细胞和细胞器仍有变形,但细胞结构基本保持完好.综上,外源硅能在一定程度上缓解重金属铜对小麦幼苗生长及细胞组分的胁迫.To explore the alleviation effect of silicon on wheat growth under copper stress, cultivar Aikang 58 was chosen as the experimental material. The growth, root activities and root tip ultra- structures of wheat seedlings, which were cultured in Hoagland nutrient solution with five different treatments （control, 15 mg·L^-1 Cu2＋, 30 mg ·L^-1 Cu2＋, 15 mg ·L^-1 Cu2＋ and 50 mg·L^-1 sili- con, 30 mg·L^-1 Cu2＋ and 50 mg·L^-1 silicon） , were fully analyzed. The results showed that root length, plant height and root activities of wheat seedlings were significantly restrained under the cop- per treatments compared with the control （ P〈0.01 ）, while these restraining effects were alleviated after adding silicon to copper-stress Hoagland and cell membrane of wheat seedling nutrient solution. Under copper stress, the cell wall root tips suffered to varying degrees of destruction, which caused the increase of intercellular space and the disappearance of some organelles. After adding silicon, the cell structure was maintained intact, although some cells and organelles were still slightly deformed compared with the control. In conclusion, exogenous silicon could alleviate the copper stress damages on wheat seedlings and cellular components to some extent.

关 键 词：小麦 铜胁迫 硅肥 超微结构 

分 类 号：S512.1[农业科学—作物学] Q945.78[生物学—植物学]