Sn-0.7Cu钎料与Cu基板间的润湿性研究  

Wettability between Sn-0.7Cu Solder and Cu Substrate under Thermoelectric Coupling Field

作　　者：程浩[1,2] 潘学民[1,2] 

机构地区：[1]大连理工大学材料科学与工程学院 [2]大连理工大学三束材料改性教育部重点实验室

出　　处：《特种铸造及有色合金》2014年第8期865-868,共4页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(50704009);中央高校基本科研业务费专项资金资助项目(DUT11SX06)

摘　　要：研究了热电耦合作用下Sn-0.7Cu无Pb钎料与纯Cu基板间的润湿性及界面反应。通过改变温度（250-350℃）、电流（1.5-4.5A）、基板的极性等参数,获得了一系列试样,测量试样的润湿角,用扫描电镜（SEM）观察截面形貌,分析了电流、温度及基板的极性对钎料与Cu基板间润湿性和界面反应的影响。结果表明,在其他参数相同时,温度升高则钎料与基板间的润湿性变好;电流增大,润湿性也可得到改善;Cu基板为阳极时的润湿性比Cu基板为阴极时更好。The wettability and interfacial reactions between Sn-0.7Cu solder and Cu substrate were investigated under thermoelectric coupling field. Effects of different current density in range of 1.5-4.5 A and temperature in range of 250-350 ℃ as well as polarity of the Cu substrate on wettability and interfacial reaction between Sn-0.7Cu solder and Cu substrate were investigated by measuring wetting angles and observing sectional morphology of the series samples prepared. The results indicate that at fixed other processing parameters, the wettability between Sn-0. 7Cu solders and the Cu substrates can be improved with temperature increase, and the increasing of the current can decrease the wettability angles. In addition, the substrate as anode also can improve the wettabilitv.

关 键 词：Sn-Cu无Pb钎料 润湿性 界面反应 热电耦合 

分 类 号：TG425[金属学及工艺—焊接]