电子工业用贵金属中低温脆性钎料研究进展  

Research Progress on Precious Metals Medium-low Temperature Brittle Filler Metals for Electronic Industry

作　　者：张利广 许昆[1,2] 赵明[1,2] 刘毅[1,2] 李伟[1,2] 罗锡明[1,2] 徐永涛 敖斌 

机构地区：[1]贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室 [2]昆明贵金属研究所,昆明650106 [3]中航工业黎阳航空发动机有限公司,贵州平坝561102

出　　处：《贵金属》2014年第3期71-78,共8页Precious Metals

基　　金：云南省自然科学基金项目(2011010207)

摘　　要：概述了电子工业用贵金属中低温脆性钎料的最新研究进展,讨论了钎料合金的微观组织对加工性能的影响。发现大部分贵金属中低温钎料含有脆性相,使其难以加工成型。介绍了这类脆性钎料的加工成形工艺,提出了贵金属中低温钎料的研究方向。The latest research progress on precious metals medium-low temperature brittle filler metals for electronic industry was summarized. And the effects of microstructure of solder alloys on processing performance were discussed. It was found that most of precious metals medium-low temperature filler metals contain brittle phases which make them difficult to process. In addition, the processing technologies of this kind of brittle filler metals were introduced and the research directions of precious metals medium-low temperature filler metals were pointed out.

关 键 词：金属材料 贵金属 中低温钎料 制备工艺 

分 类 号：TM25[一般工业技术—材料科学与工程]