LED封装胶的制备及其性能的研究  

Study on the Preparation and Properties of Encapsulating Adhesive for LED

作　　者：崔宝军[1] 陈维君[1] 李刚[1] 宋军军[1] 耿庆生[1] 梁泰硕[1] 王文博[1] 

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《化学与粘合》2014年第5期318-321,326,共5页Chemistry and Adhesion

基　　金：黑龙江省科学院科研基金项目

摘　　要：研究合成了甲基苯基乙烯基有机硅树脂、甲基苯基氢基有机硅交联剂、配位铂催化剂,再通过优化组合,制备出高透明、高折光率LED封装用有机硅胶黏剂,确定封装胶的凝胶温度100℃、固化温度110.9℃和后处理温度142.2℃,固化反应热△H为-7.74J/g。讨论了树脂、交联剂、催化剂配比对封装胶力学性能影响。分别研究了80℃、120℃、150℃下封装胶的固化状态,发现封装胶的力学特点是低温下剪切强度不高,高温强度不低。所制备的封装胶热稳定性高,通过TG分析,失重拐点在260℃左右;封装胶的光学性能优异,其透光率为98%、折光率为1.51。The methyl phenyl vinyl silicone resin, hydrogen methyl phenyl silicone cross-linking agent and platinum coordination catalyst were synthesized respectively, and then the organic silicone encapsulating adhesive was prepared by optimizing the combination. The gelation temperature of the adhesive was 100℃, the curing temperature was 110.9℃, the post-curing temperature was 142.2℃ and the enthalpy of curing reaction AH is - 7.74J/g. The effect of proportion of resin, cross linking agent and catalysts on the mechanical strength of this adhesive was discussed. The cured states of the encapsulating adhesive cured at 80℃, 120℃ and 150℃ were researched respectively. And it was found that the mechanical characteristic of this adhesive was that the shear strength was not high at low temperature, but it was not low at high temperature. The encapsulating adhesive had good thermal stability, its weight loss inflection point was 260℃ approximately. The optical property of the encapsulating adhesive was excellent, its trans- mittance was 98% and the refractive index was 1.51.

关 键 词：甲基苯基乙烯基有机硅树脂 甲基苯基氢基有机硅交联剂 配位铂催化剂 有机硅封装胶 透光率 折光率 

分 类 号：TQ433.438[化学工程]