QTi2.5/Cu镀层在NaCl溶液中的耐蚀性研究  

Corrosion Resistance of QTi2.5/Cu Coatings in NaCl Solution

作　　者：郝俊丽[1,2] 侯文义[1] 袁庆龙[1,3] 

机构地区：[1]太原理工大学机械工程学院,太原030024 [2]晋中职业技术学院煤炭化工系,山西晋中030600 [3]河南理工大学材料科学与工程学院,河南焦作454000

出　　处：《太原理工大学学报》2014年第4期437-439,443,共4页Journal of Taiyuan University of Technology

基　　金：河南省科技计划基金资助项目(102102210210)

摘　　要：采用磁控电弧离子镀方法,在纯铜基体上制备了Cu-Ti合金镀层。用SEM观察分析了镀层截面组织形貌,用XRD测定了镀层的相结构,用三电极体系及电化学阻抗谱(EIS)对镀层在质量分数为5%NaCl溶液中的耐蚀性进行了研究。结果表明,在负偏压为400V,弧电流为30A,靶基距离为145mm时,在纯铜表面镀覆的Cu-Ti合金层组织形貌呈层状结构,主要由α相组成,近基体一侧组织细密,随着镀覆时间延长组织逐渐粗化;镀层与基体结合紧密,镀层在质量分数为5%的NaCl溶液中耐蚀性优良。该研究对Cu-Ti合金镀层在腐蚀环境下的应用提供了依据。The coatings of Cu-Ti alloy were prepared by arc ion plating（AIP）on the copper substrate under the condition of magnetron.The section morphology of Cu-Ti alloy coatings was studied with SEM.The phase structure of the coatings was measured with XRD.At the same time,corrosion behavior of the Cu-Ti alloy coatings was investigated with three-electrode system and EIS in 5%NaCl solution.The results show that the morphology of Cu-Ti alloy coating presents the laminated structure,which consists chiefly ofαphase,when the negative bias voltage is400V,the arc current is 30A,the distance between target and substrate is 145mm.The microstructure near the substrate is fine.As the plating time goes on,the microstructure becomes gradually coarsening.The bond between the copper substrate and alloy coating is compact.The corrosion resistance of the Cu-Ti coating is very good in 5% NaCl solution.The experiment on the microstructure characteristics and corrosion resistance of Cu-Ti alloy coating provides the basis for its application in the corrosion environment.

关 键 词：电弧离子镀 Cu-Ti合金镀层 耐蚀性 

分 类 号：TG174.444[金属学及工艺—金属表面处理]