铝基复合材料TLP扩散焊接头的组织及性能  

Microstructure and Properties of Aluminum Matrix Compositite Joint with Transient Liquid-phase Diffusion Bonding Process

作　　者：陈思杰[1] 朱春莉[1] 魏明强[1] 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003

出　　处：《热加工工艺》2014年第17期187-189,共3页Hot Working Technology

基　　金：河南省教育厅科技攻关项目(13A430317);河南理工大学博士基金资助项目(B2009-5)

摘　　要：在开放环境下,用氩气保护,采用Ag-Cu-In-Sn合金箔作中间层,对SiC体积分数为55%的SiCP/Al复合材料进行瞬时液相扩散焊,研究了焊接温度对接头显微组织、力学性能的影响。结果表明:随着焊接温度的升高,焊缝变窄,剪切强度升高,在焊接温度为580℃时接头的剪切强度为80MPa,组织性能最好。The aluminum matrix compositite was welded by transient liquid-phase bonding process using Ag-Cu-In-Snfiller in argon atmosphere. The microstructure and mechanical properties of the transient liquid-phase bonding joint wasanalyzed by changing bonding temperature. The results show that as the welding temperature increasing, the weld seam isnarrowed, and the shear strength increases. The microstructure and properties of TLP bonding joint are best with the bondedtemperature at 580 ℃ heated for 6 min. The shear strength of the welded joint is 80 MPa.

关 键 词：铝基复合材料 瞬时液相扩散焊 显微组织 剪切强度 

分 类 号：TG407[金属学及工艺—焊接]