基于Icepak的通信电子设备热设计及优化  

Thermal Design and Optimization for Communication Electronic Equipment Based on Icepak

作　　者：刘恒[1] 张学新[1] 陈正江[1] 

机构地区：[1]中国电子科技集团第三十研究所,四川成都610041

出　　处：《通信技术》2014年第9期1104-1108,共5页Communications Technology

摘　　要：本文结合通信电子设备工程实际,阐述了基于Icepak的通信电子设备热设计及优化的过程,探索了一种仿真计算与优化验证的热设计方法。文中通过初步计算选择合理的散热方式及确定散热布局,并详细介绍了利用Icepak软件对散热布局进行仿真计算的过程和散热器的参数化及优化设计过程。这种基于Icepak的热设计方法能明显提高设计效率,解决工程实际问题,对于通信电子设备的热设计具有参考意义。In this paper, integrated with engineering practice of communication electronic equipment, the process of thermal design and optimization is discussed particularly based on Icepak and a certain method of simulation and optimization is probed carefully. First, an appropriate heat dissipation method is chosen and a kind of arrangement for thermal spilling out is identified by preliminary calculating. By using Icepak software, the process of simulation calculation for thermal spilling out arrangement and radiator parameter optimization are introduced in detail. This thermal design based on Icepak can improve the design efficien-cy obviously,solve engineering problem, and provide reference value for thermal design of communication electronic equipments.

关 键 词：通信电子设备 Icepak软件 热设计 仿真计算 优化设计 

分 类 号：TN917[电子电信—通信与信息系统]