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作 者:叶雨顺 左孝青[1] 杨牧南[1] 周芸[1] 陆建生[1]
机构地区:[1]昆明理工大学材料科学与工程学院,昆明650093
出 处:《功能材料》2014年第19期19030-19034,共5页Journal of Functional Materials
基 金:云南省应用基础研究重点资助项目(2010CC004);昆明理工大学创新团队资助项目(2010-2015)
摘 要:为提高铜-石墨复合材料的相对密度,改善其组织和性能,采用氩气保护下的压力烧结技术制备了铜-石墨复合材料,研究了烧结压力、压制压力、烧结温度和烧结时间对铜-石墨复合材料相对密度及性能的影响,探讨了相对密度与性能的关系。结果表明,适当提高压力烧结各参数可减少孔隙数量,改善组织均匀性,提高材料相对密度,进而提高材料硬度和导电率;材料性能主要取决于相对密度,相对密度越高,性能越好,但材料性能还受孔隙尺寸和形状的影响;在烧结压力为150 MPa、压制压力为400 MPa,烧结温度为870了℃,烧结时间为2.5 h条件下获得了相对密度为0.945,硬度为66.3 HB,电导率为6.2 MS/m的铜-石墨复合材料。To improve the relative density,microstructure and properties of copper-graphite composites,an ar-gon protective pressure sintering technology was adopted.The effects of sintering pressure,compacting pres-sure,sintering temperature and sintering holding time on relative density and properties,and the relationship between the relative density and properties were studied.The results showed that:an appropriate increasing with experimental parameters of the pressure sintering processing of copper-graphite composites was beneficial to decrease the number of pores,enhance uniformity of the microstructure,enhance relative density,therefore, increase hardness and conductivity.The properties were mainly determined by the relative density,the higher the relative density,the better the performance,however,they were also affected by the size and shape of the pores.The copper-graphite composites with relative density 0.945, hardness 66.3 HB and conductivity 6.2 MS/m were fabricated by the following optimal parameters:sintering pressure 150 MPa,compacting pres-sure 400 MPa,sintering temperature 870 ℃ and sintering holding time 2.5 h.
关 键 词:铜-石墨复合材料 压力烧结 相对密度 硬度 电导率
分 类 号:TG146.1[一般工业技术—材料科学与工程]
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