屏蔽挡板对电铸微模芯厚度均匀性的影响  

Effects of Non-conducting Shield on Thickness Uniformity of Micro-electroformed Mold Insert

作　　者：马鑫[1] 蒋炳炎[1] 陈中原[1] 吕辉[1] Stefan Kirchberg 

机构地区：[1]中南大学机电工程学院高性能复杂制造国家重点实验室 [2]Institute of Polymer Materials and Plastics Engineering,Clausthal University of Technology,Clausthal-Zellerfeld 38678,Germany

出　　处：《电镀与环保》2014年第5期8-11,共4页Electroplating & Pollution Control

基　　金：国家自然科学基金项目(No.51150110343);中南大学大学生创新训练项目(No.CL11126)

摘　　要：利用有限元分析软件Ansys对电铸系统中阴极电流密度分布进行模拟。研究了不同屏蔽挡板对阴极电流密度分布的影响,预测了电铸模芯厚度均匀性的变化趋势。结果发现:屏蔽挡板能提高电铸模芯的厚度均匀性;当屏蔽挡板的方孔与阴极等大时,模芯的厚度均匀性最佳,模芯边缘与中心的厚度比由不使用屏蔽挡板时的2.03缩减至1.15。根据仿真优化结果设置对照实验。使用厚度测量仪检测样品各点的厚度,采用影像测量仪观察微透镜阵列模芯表面形貌及截面厚度的分布情况。实验结果与仿真结果匹配,优化后的模芯边缘与中心的厚度比为1.42,形貌与母版的基本一致。The cathode current density distribution in the electroforming system was simulated using finite element analysis software Ansys.The effects of different non-conducting shields on the cathode current density distribution were investigated,and the thickness variation trend of electroformed mold insert was forecasted.The results show that non-conducting shield can improve the thickness uniformity of electroformed mold insert; when the square hole size of the non-conducting shield is consistent with the cathode,the micro-electroformed mold insert has the best thickness uniformity,the thickness ratio of edge to center is reduced to 1.15 from 2.03 without non-conducting shield.The control experiment was set according to the simulating optimization results.The thickness of each testing point of the sample was measured by thickness gauge; the surface morphology and section thickness distribution of micro-lens array mold insert was observed with image measuring instrument.The experimental results match well with the simulation results,the edge-to-center thickness ratio of the optimized mold insert is 1.42,and the morphology is basically the same as the master.

关 键 词：电铸微模芯 有限元仿真 微透镜阵列 厚度均匀性 

分 类 号：TQ153.4[化学工程—电化学工业]