丁二酰亚胺体系银的电沉积过程  

Silver Electrodeposition Process in Succinmide Solution

作　　者：朱雅平[1] 王为[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《中国表面工程》2014年第5期39-44,共6页China Surface Engineering

基　　金：国家重点基础研究发展计划(973计划)(2013CB632500)

摘　　要：采用循环伏安法(CV)测试,结合量子化学计算和扫描电子显微镜(SEM)分析,研究了配位剂丁二酰亚胺对银电沉积过程的影响。结果表明:Ag+与丁二酰亚胺配位后,还原电位负移。不同丁二酰亚胺浓度和pH值条件下,丁二酰亚胺与Ag+形成的配合物形式以及配合物稳定性均不同。随着丁二酰亚胺浓度增大以及pH值升高,形成的配合物也更稳定。当pH为10时,丁二酰亚胺与Ag+能够形成稳定的配合物[Ag(C4H4NO2)2]-、[Ag(C4H4NO2)3]2-和[Ag2(C4H4NO2)4]2-。在适宜的电位范围内能够制备出结构致密、表面平整的银镀层。Effects of succinimide on the electrochemical reduction process of Ag^＋in solution were investigated by cyclic voltammetry（CV）,quantum chemical calculation and scanning electron microscope（SEM）.The results show that reduction potential of Ag^＋negatively shifts with the addition of complexing agent.Variation of the solution pH and complexing agent concentration affects the complex forms and stability.The compound complexed by succinimide and Ag^＋is more stable when the complexing agent concentration and pH is higher.Ag^＋are reduced as the form of[Ag（C4H4NO2）2]^-,[Ag（C4H4NO2）3]^2-and[Ag2（C4H4NO2）4]^2-that are stable in the succinimide solution when pH is 10.The coating obtained under the optimum conditions is compact smooth.

关 键 词：银离子 电沉积 丁二酰亚胺 配合物体系 

分 类 号：TG174.441[金属学及工艺—金属表面处理] O641[金属学及工艺—金属学]