TSOP器件焊点开裂原因分析  

Failure Analysis for Solder Joint Cracking of TSOP Devices

作　　者：任康[1] 王奇锋[1] 张娅妮[1] 何睿[1] 

机构地区：[1]中航工业西安航空计算技术研究所,陕西西安710077

出　　处：《电子工艺技术》2014年第5期264-267,283,共5页Electronics Process Technology

基　　金：航空科学基金项目(项目编号:20100231001)

摘　　要：通过对一起TSOP器件焊点开裂案例的原因进行排查,详细分析了引线镀层、引线出线方式、封装体材料、引线材料对焊点开裂形成的作用。总结了焊点开裂的产生机理。阐明了在设计时正确选择TSOP器件类型和规范TSOP器件引线成形的重要性。最后,简要介绍了提高TSOP器件焊接可靠性的措施。Based on an investigation of solder joints cracking reason for TSOP device, the role of lead plating, lead outstretching mode, packaging material, lead material on the formation of solder joint cracking is analyzed, while the generation mechanism of solder joint cracking is summed up. The importance of selecting the TSOP devices type correctly during design process and standardizing TSOP devices lead forming are being illuminated. Finally some measures are being introduced briefly to improve the welding reliability of TSOP devices.

关 键 词：TSOP 焊点开裂 可靠性 引线成形 封装材料 

分 类 号：TN60[电子电信—电路与系统]