异步累积叠轧制备超细晶纯铜微观组织演化规律及细化机制  

Microstructure Evolution and Refinement Mechanism of Ultra-fine Copper Prepared by Asymmetrical Accumulative Roll Bonding

作　　者：周蕾[1] 史庆南[2] 王军丽[3] 

机构地区：[1]昆明理工大学冶金与能源学院,昆明650093 [2]昆明理工大学材料科学与工程学院,昆明650093 [3]昆明理工大学分析测试中心,昆明650093

出　　处：《航空材料学报》2014年第5期49-54,共6页Journal of Aeronautical Materials

基　　金：国家自然科学基金资助项目(51064016;50804018);稀贵及有色金属先进材料教育部重点实验室开放基金资助项目(ZDS2010015C);2010云南省科技条件平台建设计划项目(2010DH025)

摘　　要：对纯铜进行一至三道次大塑性异步累积叠轧变形,观察显微组织及晶界的演变过程,并探讨了纯铜异步累积叠轧的晶粒细化机制。结果表明：纯铜异步累积叠轧形成S带;S带中形成连续的纵横交割位错墙,将S带分割、细化,获得具有亚晶结构的超细晶纯铜,亚晶尺寸为0.5～1μm。异步累积叠轧晶粒细化过程中,形成断断续续的分散状态的小角度亚晶界,在剪切力作用下逐渐合并成为超细晶粒中连续的小角度亚晶界。The microstructure and grain boundaries of the copper prepared by Asymmetrical Accumulative Roll Bonding（AARB） within 1 to 3 passes were studied, and the grain refinement mechanism of AARB was obtained. The results show that S-band is obtained in AARB process. The S-band parted by the consecutive dislocation walls crosses inside, and the ultra-fine copper with sub-grains is prepared. Sub-grain boundaries with low-angle are obtained in the refine process of AARB. And with the shear stress,these discontinuous low-angle boundaries are combined as the sub-grain boundaries.

关 键 词：异步累积叠轧 纯铜 细化机制 S带 晶界 

分 类 号：TG33[金属学及工艺—金属压力加工]