无溶剂TGBAPP型耐高温环氧胶粘剂的研制  

Preparation of Solvent-free TGBAPP Type High Temperature Resistant Epoxy Adhesive

作　　者：虞鑫海[1] 虞静远[1] 陈吉伟 刘万章 

机构地区：[1]东华大学应用化学系,上海201620 [2]浙江金鹏化工股份有限公司,浙江台州318050

出　　处：《绝缘材料》2014年第5期19-22,共4页Insulating Materials

摘　　要：N,N,N',N'-四缩水甘油基-2,2-双[4-(4-氨基苯氧基)苯基]丙烷(TGBAPP)作为一种新型四官能团环氧树脂,因其分子中含有2个柔性基团(醚键)和四个环氧基团,与固化剂反应生成交联网状结构,可作为一种耐热基体树脂。以TGBAPP、DADP248耐高温活性增韧剂、甲基四氢苯酐(MTHPA)为原料,制得一种性能优异的环氧胶粘剂,并对其性能进行了测试。结果表明:该环氧胶粘剂具有良好的疏水性、力学性能和耐热性能。室温、190℃、240℃下拉伸剪切强度分别为30.3 MPa、22.8 MPa、4.8 MPa,表面能为38.0 mJ/m2,远小于水的表面能(72mJ/m2),吸水率为1.65%。N,N,N′,N′-tetralycidyl-2,2-bis[4-（4-aminophenoxy）phenyl]propane （TGBAPP） is a novel tetrafunc-tional epoxy resin. Because TGBAPP molecule contains two flexible groups （ether bond） and four epoxy groups, and it can react with curing agent forming cross-linked structure, therefore it can used as a high temperature resistance matrix resin. Using TGBAPP, high temperature resistance reactive toughener （DADP248）, and methyl tetrahydrophthalic anhydride （MTHPA） as raw materials, we prepared a novel epoxy adhesive, and its properties were tested. The results show that the epoxy adhesive has excellent hydrophobicity, mechanical properties, and heat resistance. The tensile shear strength of the novel epoxy adhesive at room temperature, 190℃, and 240℃ is 30.3 MPa, 23.8 MPa, and 4.8 MPa respectively. The surface energy is 38.0 mJ/m2, which is much less than the surface energy of water（72 mJ/m2）, and the water absorption rate is 1.65%.

关 键 词：N N N’ N'-四缩水甘油基-2 2-双[(4-氨基苯氧基)苯基]丙烷 环氧树脂 胶粘剂 无溶剂 耐高温 

分 类 号：TM215.43[一般工业技术—材料科学与工程]