微纳热压印真空装置研制  

Development on Micro/Nano Hot Embossing Vacuum Machine

作　　者：段亚杰[1] 李经民[1] 刘冲[1] 王蕾[1] 

机构地区：[1]大连理工大学机械工程学院,辽宁大连116024

出　　处：《机械设计与制造》2014年第10期53-56,共4页Machinery Design & Manufacture

基　　金：国家自然科学基金(91023017;51105060;51375076);国家863计划资助项目(2012AA040406)

摘　　要：在非真空环境中进行微纳压印,在模板和聚合物基底之间会形成气泡,降低微纳结构的转印质量,针对该问题,研制了一种微纳热压印真空装置。该装置包括:用于调整压头板位姿的球状自适应调整结构,以半导体热电致冷器为加热和致冷器件的温度控制装置,真空罩,密封系统。计算了热压印过程需要的加热和制冷功率,进行了升降温和保温性能实验、真空性能实验和应用实验,实验结果验证此装置整体性能良好,适用于微纳热压印。In the non vacuum environment,bubbles will be formed between the mold and the polymer substrate ,they will affect the quality of micro/nano structures fabricated by imprinting, a micro/nano hot embossing machine is designed to solve the problem The device includes adjust automatic mechanism which can adjust the position of pressure head adaptively, temperature control system based on thermoelectric cooler, vacuum enclosure and sealing system The power of heating/ cooling in hot embossing process is calculated, the experiment of temperature rising/falling speed and temperature keeping, the experiment of vacuum and the experiment of application are carried out. The results indicate that the device has high overall performance, and it is suitable for micro/nano hot embossing.

关 键 词：热压印 密封 热电致冷器 温度 真空 

分 类 号：TH16[机械工程—机械制造及自动化] TH703