耐高温环氧树脂胶粘剂的研究进展  

Research progress of epoxy resin adhesives with high temperature resistant

作　　者：武杨[1] 巫辉[1] 原晔[1] 

机构地区：[1]武汉理工大学化学系,湖北武汉430070

出　　处：《中国胶粘剂》2014年第10期55-58,共4页China Adhesives

摘　　要：介绍了耐高温环氧树脂(EP)胶粘剂中无机填料、热塑性树脂、酚醛树脂(PF)、纳米粒子和结构调整等EP改性方法的研究进展,特别对双马来酰亚胺(BMI)改性EP及有机硅改性EP进行了综述。最后对耐高温EP胶粘剂的发展前景进行了展望。The research progress of modified methods [such as inorganic filler,thermoplastic resin,phenolic resin（PF）,nanoparticles,structural adjustment and other modified methods] was introduced in the EP（epoxyresin） adhesives with high temperature resistant. Especially,the bismaleimide （BMI） modified EP and organic silicone modified EP were summarized. Finally,the development prospect of the EP adhesives with high temperature resistant was expected.

关 键 词：耐高温 环氧树脂 胶粘剂 双马来酰亚胺 

分 类 号：TQ433.437[化学工程]