真空平板玻璃封接性能研究  

Properties of vacuum plate glass for sealing

作　　者：缪宏[1] 单翔[1] 张瑞宏[1] 张剑峰[1] 左敦稳[2] 王红军[3] 

机构地区：[1]扬州大学机械工程学院,江苏扬州225000 [2]南京航空航天大学机电学院,南京210016 [3]南京工业职业技术学院,南京210046

出　　处：《功能材料》2014年第21期21094-21097,21102,共5页Journal of Functional Materials

基　　金：国家青年科学基金资助项目(51302242);国家自然科学基金资助项目(51172199;51372216);江苏省自然科学基金资助项目(BK2012530);江苏省高校自然科学研究资助项目(BKJB460016);江苏省科技支撑资助项目(BE2010700);江苏省产学研联合创新资金计划资助项目(SBY201120191);扬州市建设科技计划资助项目(2012BAD32B11)

摘　　要：针对真空平板玻璃封接温度较低和玻璃与封接焊料要具有相匹配热膨胀系数的特点,实验选定PbOGTiO2GSiO2GRxOy 系封接焊料,采用真空熔接法侧边封接真空平板玻璃,利用EBSD、EDS、XRD 方法分析了真空平板玻璃封接层的显微组织结构与物相组成,研究了封接层与玻璃界面处结合性与稳定性,并对真空平板玻璃封边进行了剪切强度与气密性实验,测定了真空平板玻璃封边处的剪切性能与气密性能,探讨了真空平板玻璃的封接机制.结果表明,封接层与玻璃之间的界面清晰,结合紧密,封接效果良好,封接层分为厚度在7-9μm 的界面反应润湿层与厚度在180-190μm 的熔融层两个部分,界面处出现了元素迁移,并在界面反应润湿层生成了少量的PbTiO3.封接层无明显裂纹,存在少量不连通的气孔,但不影响其气密性能,封边气密性达到1.0×10-9 Pa·m3/s.According to the characteristics of lower sealing temperature of the vacuum plate glass and coefficient of thermal expansion of phase match between the glass and the sealing solder,the experiment selected the seal-ing solder of the PbO-TiO2-SiO2-Rx Oy system.The edges of the vacuum plate glass were sealed with welding process under vacuum.The microstructure and phase composition of sealing edges of the vacuum plate glass were analyzed for EBSD,EDS and XRD.The associative property and stability at the interfaces between the sealing layer and the glass were studied.And the sealing solder of the vacuum plate glass was experimented with shear strength and air tightness,and measured shear performance and airtight performance.Sealing mechanism of the vacuum plate glass was explored.The results show that the interface between the glass and the sealing solder was clear,related closely and sealing effect was well.The sealing layer divides into the wetting layer for reacting with the interface and the melting layer,and the thickness was 7-9μm and 180-190μm respectively. The interface appears element migration.The wetting layer for reacting with the interface creates few PbTiO3 . The sealing layer barely exists obvious cracks and exists few disconnected pore,but not affect its airtight per-formance.Air tightness of the sealing solder reaches 1.0×10-9 Pa??m3/s.

关 键 词：真空平板玻璃 封边 界面 结合性 气密性 

分 类 号：TQ171.727[化学工程—玻璃工业]