精密模具大面积微结构电铸制备工艺研究  

Study on Electroforming Process in Precision Mold with Large Area Microstructures

作　　者：郑文书[1] 郭钟宁[1] 江树镇[1] 陈日[1] 罗红平[1] 

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《南京航空航天大学学报》2014年第5期804-809,共6页Journal of Nanjing University of Aeronautics & Astronautics

基　　金：国家自然科学基金(U1134003)资助项目;国家自然科学基金青年基金(51105080)资助项目;广东省自然科学基金博士启动基金(S2011040003991)资助项目

摘　　要：对精密模具大面积微结构的电铸制备工艺进行了研究.研究了掩膜厚度、化学微蚀刻、二次辅助阴极对精密模具大面积微结构电铸成型的影响.结果表明,化学微蚀刻能进一步去除显影残胶,提高镀层微结构与模具基板的结合力.在曝光时间为100 s,曝光能量为750～810 mJ/cm^2的曝光工艺条件下,掩膜厚度在130～160 μm时,可以得到线宽为100 μm侧壁陡直度较好的精密模具微结构.采用外加电势的二次辅助阴极三电极电铸体系可以提高铸层的均匀性.Electroforming process in precision mold with large area microstructures is studied.Effects of micro-chemical etching,mask thickness and secondary auxiliary cathode on large area microstructures of precision mold fabricated by the electroforming process are discussed.The results show that,it can be strengthened by micro-chemical etching step for further removing the developing adhesive residue and improving the coating adhesion between the microstructure and the mold substrate.The microstructures with best sidewall angle can be obtained in the conditions that the exposure time is 100 s,the exposure energy is 750-810 mJ/cm^2,the mask thickness is 130-160μm,and the precision dies is with the line width of 100μm side.Furthermore,the three-electrode electroforming system with a potential secondary auxiliary cathode can improve the uniformity of the electrodeposition layer.

关 键 词：大面积微结构 均匀性 电化学沉积 侧壁陡直度 二次辅助阴极 

分 类 号：V261.5[航空宇航科学与技术—航空宇航制造工程]