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出 处:《电工材料》2014年第6期9-12,共4页Electrical Engineering Materials
摘 要:为研究Ag Cd合金的加工工艺对内氧化后的Ag Cd O触点材料组织的影响,改善高Cd含量的Ag Cd O触点材料的组织和性能,本文采用两种不同的工艺制备了Ag Cd O(17)触点材料。结果表明,新工艺制备的Ag Cd O触点较常规工艺具有组织均匀、复银界面良好的特点。这两种工艺加工触点材料组织变化源于其加工原理和组织形成机理存在着差异:常规工艺热轧发生动态再结晶,组织均匀细小,易冷轧细化和内氧化粗化;新工艺组织由大量粗大的退火孪晶组成,不易冷轧细化,内氧化过程中长大也缓慢。此外,新工艺中的退火处理分散了内氧化前与氧逆扩散富集于复银界面处的Cd原子,从而使Ag Cd O触点获得了良好的复银界面。In order to study the effects of processing technology of AgCd alloys on the AgCdOcontact materials microstructures, two different processes were applied to prepare the AgCdOcontact materials in this study. Results show that, compared with the contacts prepared byconventional process, AgCdO contacts prepared by the new process have homogeneous microstructureand good interface between the welding-silver layer and the AgCdO layer. The differences inmicrostructure are owing to the different processing principles and formation mechanism. Dynamicrecrystallization occurs during hot rolling in the conventional process, and the homogeneousmicrostructure which is easy to be refined by cold rolling and coarsen in the internal oxidationtreatment is obtained. A large number of annealing twins are observed in the microstructure of thenew process, which are hard to be refined and grow slowly during the internal oxidationtreatment. In addition, Cd atoms which enrich at the interface by reverse diffusion with oxygenbefore internal oxidation are dispersed by the annealing treatment in the new process, so the goodinterface of AgCdO can be achieved.
分 类 号:TM501.3[电气工程—电器] TG146.32[一般工业技术—材料科学与工程]
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