可形成固化膜的免清洗助焊剂的研制  

Development of no-clean flux including a curable film

作　　者：秦春阳[1,2] 李海普[1] 杨鹰[1] 陆文霞[1] 姜腾达[1] 

机构地区：[1]中南大学化学化工学院,长沙410083 [2]天马微电子股份有限公司,深圳518118

出　　处：《化工新型材料》2014年第11期56-59,共4页New Chemical Materials

基　　金：国家军品配套项目(JPPT-125-GH-039);中南大学研究生自主探索创新项目(2013zzts173)

摘　　要：针对无铅焊料用助焊剂出现的焊后焊点可靠性问题,提出了可形成固化膜的助焊剂配方设计思路。配方以环氧树脂作为助焊剂的成膜物质,利用其固化后表现出优异的力学与电气稳定性,提高焊点的可靠性。实验在成膜物质的基础上,对活化剂、溶剂以及表面活性剂等进行了优化选择,并对最终配方做了相关性能检测。结果表明:实验制备的免清洗助焊剂无卤素,表面绝缘电阻达到1012Ω,无明显电化学迁移,润湿效果良好,平均扩展率接近79%。The design thinking of no lead flux including a curable film was put forward with respect to the problems of no-lead flux＇s reliability. The cured epoxy resin exhibited an excellent stability of mechanics and electricity,and was chosen as film forming emulsifiers of flux. On the basis of emulsifiers,the active agents,solvent and surfactants in fluxes were selected respectively. The composition was optimized,and the properties were tested for the flux. The results suggested that the flux was free-halogen, surface insulation resistance reached to 10^12Ω and low electrochemical migration. The diversified properties of the no-clean flux met the standard requirements, and it achieved an excellent soldering performance and aver age expansion rate of 79 %.

关 键 词：环氧树脂 固化膜 可靠性 检测 

分 类 号：TG425[金属学及工艺—焊接]