TGBAPS/MNA/EMI-24体系的固化行为研究  

Study on curing characteristics of TGBAPS/MNA/EMI-24 system

作　　者：孙莺[1] 邱郑富 徐菁[1] 郑爽[1] 孙鑫[1] 方琳[1] 陆航[1] 胡和丰[1] 

机构地区：[1]上海大学材料科学与工程学院高分子材料系,上海200444

出　　处：《化工新型材料》2014年第11期160-162,共3页New Chemical Materials

摘　　要：采用非等温动态示差扫描量热法(DSC)和热失重分析法(TGA)研究了N,N,N’,N’-四缩水甘油胺-3,3’-双(4-氨基苯氧基)二苯砜/甲基纳迪克酸酐/2-乙基-4-甲基咪唑(TGBAPS/MNA/EMI-24)体系的固化反应过程及固化物的热稳定性。由Kissinger方程和Ozawa方程求得该体系固化反应的表观活化能分别为84.1kJ/mol和87.1kJ/mol;由Crane方程求得固化反应近似为一级反应;TGBAPS/MNA/EMI-24体系固化物具有良好的耐热性能,其Tg为215℃,5%、15%和30%的失重温度分别为317℃、331℃和359℃。The curing reaction of N, N, N＇, N-tetraglycidyl 3,3-his （4 amino phenyl）diphenylsulfone/methyl nadic anhydride/2 ethyl 4 methylimidazole system and thermal stability of cured resin were investigated by differential scanning calorimetry（DSC）and thermogravimetric analysis（TGA）. The curing apparent activation energy were 84. 1 kJ/mol and 87. 1kJ/mol calculated by the Kissinger and Ozawa method,respectively. The curing reaction was approximately first order re action obtained by the Crane equation. The cured resin showed good heat resistance, its Tg was 215℃,the 5%, 15% and 30% mass loss temperature of cured resin were 317℃ ,331℃ and 359℃ ,respectively.

关 键 词：四缩水甘油胺基环氧树脂 甲基纳迪克酸酐 非等温动态DSC 固化行为 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]