超高速旋转金刚石划片刀制造工艺的研究  

Manufacturing process of ultra-high-speed rotating dicing blade

作　　者：李东亚[1] 冯志华[1] 胡攀登 

机构地区：[1]苏州大学应用技术学院,苏州215000 [2]库力索法半导体(苏州)有限公司,苏州215000

出　　处：《金刚石与磨料磨具工程》2014年第5期47-49,55,共4页Diamond & Abrasives Engineering

摘　　要：刀具在进行超高速切削工件时,刀具结构上及切削参数的变化会对工件的质量产生很大的影响。在超高速切削机床上用其进行切削实验,对切削硅晶片的划片刀的车削工艺、电镀工艺和后续加工工艺进行研究,利用改变切削参数中的走刀速度,并对切削之后的工件切缝宽度进行测量,得出切缝宽度与走刀速度关系,得出优化的切削参数。When ultra-high-speed cutting tool during the work, the quality of the tool structur parameters change will have a huge impact on the workpiece, the paper turning process silicon blade stroke, the plating process and follow-up process are discussed by in its ultra-high speed cu e and cutting wafer cutting tting machine for cutting experiment by changing the cutting parameters cutting speed, and cutting the workpiece kerr width measurements, obtained kerf width with cutting speed diagram, drawn optimized cutting parameters.

关 键 词：超高速切削 切削实验 工艺参数优化 

分 类 号：TQ164[化学工程—高温制品工业] TG74[金属学及工艺—刀具与模具]