Electrochemical micromachining of micro-dimple arrays on cylindrical inner surfaces using a dry-film photoresist  

作　　者：Qu Ningsong Chen Xiaolei Li Hansong Zeng Yongbin 

机构地区：[1]College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics [2]Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology

出　　处：《Chinese Journal of Aeronautics》2014年第4期1030-1036,共7页中国航空学报（英文版）

基　　金：supported by the Joint Funds of the National Natural Science Foundation of China and Guangdong Province(No.U1134003)

摘　　要：The application of surface textures has been employed to improve the tribological performance of various mechanical components. Various techniques have been used for the application of surface textures such as micro-dimple arrays, but the fabrication of such arrays on cylindrical inner surfaces remains a challenge. In this study, a dry-film photoresist is used as a mask during through-mask electrochemical micromachining to successfully prepare micro-dimple arrays with dimples 94 lm in diameter and 22.7 lm deep on cylindrical inner surfaces, with a machining time of 9 s and an applied voltage of 8 V. The versatility of this method is demonstrated, as are its potential low cost and high efficiency. It is also shown that for a fixed dimple depth, a smaller dimple diameter can be obtained using a combination of lower current density and longer machining time in a passivating sodium nitrate electrolyte.The application of surface textures has been employed to improve the tribological performance of various mechanical components. Various techniques have been used for the application of surface textures such as micro-dimple arrays, but the fabrication of such arrays on cylindrical inner surfaces remains a challenge. In this study, a dry-film photoresist is used as a mask during through-mask electrochemical micromachining to successfully prepare micro-dimple arrays with dimples 94 lm in diameter and 22.7 lm deep on cylindrical inner surfaces, with a machining time of 9 s and an applied voltage of 8 V. The versatility of this method is demonstrated, as are its potential low cost and high efficiency. It is also shown that for a fixed dimple depth, a smaller dimple diameter can be obtained using a combination of lower current density and longer machining time in a passivating sodium nitrate electrolyte.

关 键 词：Dry-film photoresist Electrochemical machining Electrochemical micromachining Inner surface Micro-dimple arrays Texture 

分 类 号：TG662[金属学及工艺—金属切削加工及机床] TG174.42