PCB接触通流能力分析及评估软件开发  

Analysis of Let-Through Current Capability of PCB and Development of Software

作　　者：冲锋[1] 胡书通[1] 李兴文[1] 韩承章[2] 朱勇发[2] 

机构地区：[1]西安交通大学电力设备电气绝缘国家重点实验室,陕西西安710049 [2]华为技术有限公司,广东深圳518129

出　　处：《电器与能效管理技术》2014年第16期1-5,共5页Electrical & Energy Management Technology

摘　　要：介绍了一种基于热电耦合评估PCB温升的方法以及基于仿真与试验结果开发的PCB接触通流评估软件。考虑螺栓连接处的接触电阻,建立了PCB电流传导模型,计算PCB电流密度与发热功率分布;继而建立了考虑传导、对流和辐射的PCB传热模型,计算PCB温度分布。根据仿真结果,分析了PCB铜箔面的温度分布规律及原因,并对比分析了四层铜箔PCB温度随电流和接触端子拧紧力矩变化的规律。同时,开展了相应的PCB接触通流测量试验,仿真与试验结果吻合,验证了计算模型的有效性。最后,开发了相关的PCB接触通流评估软件。This paper introduced an integrated calculation method that couples the calculations of current distribution and steady temperature field by using the finite element software Ansys,and developed the software for evaluating the let-through current capabilities. First,with the current conductivity model of PCB considering the contact resistance in the connecting bolt,the current density distribution and the heating power distribution were calculated,then taking the thermal conductivity,convection and radiation into account,the heat transfer model of PCB was proposed,and the temperature distribution of PCB was calculated. The temperature distribution of PCB was analyzed. It is found that the current and torque influence greatly the temperature distribution of PCB. The relevant experiment confirms the validity of the present calculation. Moreover,the relevant software for evaluating the letthrough current capability was developed.

关 键 词：PCB 热分析 接触电阻 温度场 接触通流能力评估软件 

分 类 号：TM201.42[一般工业技术—材料科学与工程]