干涉法测量双层树脂基材料内部的压缩位移场分布  

Measurement of compression displacement fields in dual layer epoxy composites by interferometry

作　　者：周延周[1] 刘运红[1] 刘羽飞[1] 徐金雄 章云[1] 

机构地区：[1]广东工业大学自动化学院,广东广州510006

出　　处：《光学精密工程》2014年第11期2923-2929,共7页Optics and Precision Engineering

基　　金：国家自然科学基金资助项目(No.11072063);广东省自然科学基金资助项目(No.S2012010010327)

摘　　要：建立了基于迈克尔逊干涉结构的深度分辨倾斜激光波数扫描干涉测量系统,对双层树脂基复合材料样品的压缩位移场分布进行了测量及分析。首先,采用分布反馈(DFB)半导体激光器对双层树脂基复合材料样品进行波数扫描干涉测量;然后,采用随机采样傅里叶变换(RSFT)计算双层树脂基复合材料样品加载前后的相位差;最后,运用解卷绕算法对材料样品加载前后的相位差进行解卷绕,计算出各表面压缩位移场的分布。实验结果表明,压缩位移场分布的测量精度达到±100nm,深度方向的轮廓分辨率约为0.41mm,最大测量深度约为52mm。该方法能够准确测量出树脂基复合材料的压缩位移场分布,测量时不受树脂基复合材料内部切面弹性模量的影响,具有测量精度高,系统稳定,抗干扰能力强等特点。A tilt depth-resolved wavenumber-scanning Michelson interferometer was built up to measure and analyze the compression displacement field distributions on the fore,middle and rear surfaces of dual layer epoxy composites.A Distribution Feedback （DFB） diode laser whose wavenumber could be modulated by the temperature was used to perform the wavenumber-scanning interferometric measurement for the dual layer epoxy composites.A Random-Sampling Fourier Transform （RSFT） was designed to evaluate the phase differences of the dual layer epoxy composite samples before and after applying loads.Finally,the unwrapping algorithm was used to unwrap the phase differences for the samples before and after applying loads and the compression displacement field distributions of every surfaces on or inside the epoxy composites were given out.Experimental results indicate that measurement resolutions of the compression displacement field distribution are ±100nm,and the profile resolution in depth and the maximum measurement depth are 0.41 mm and 52 mm,respectively.This method accurately measures the compression displacement field distribution,and its measurement is independent on the internal plane elastic modulus size of resin matrix composites.It is characterized by higher measuring accuracy,stable system and stronger resisting disturbance.

关 键 词：波数扫描干涉术 树脂基复合材料 压缩位移场 

分 类 号：TB332[一般工业技术—材料科学与工程] TH744.3[机械工程—光学工程]