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作 者:明五一[1,2] 沈娣丽[3] 郭建文[2,4] 张臻[2,4] 陈志[2] 李贺[2]
机构地区:[1]东莞华科精机有限公司,广东东莞523808 [2]华中科技大学机械科学与工程学院,湖北武汉430074 [3]中州大学工程技术学院,河南郑州450015 [4]东莞华中科技大学制造工程研究院、广东省制造装备数字化重点实验室,广东东莞523808
出 处:《机床与液压》2014年第21期118-120,124,共4页Machine Tool & Hydraulics
基 金:广东省数控一代示范工程项目(2012B011300044,2012B011300015)
摘 要:针对包装工业急需的高性能智能化多层共挤吹塑装备的特点,提出了该装备关键技术的实现方法。研究了数控系统所需要的底层支撑算法,测试与分析数据表明:该算法具有可行性、可靠性和高效性;基于芯片级别的片上优化技术,将支撑算法改造成能够在芯片上实现的硬件算法,提高了算法的运行速度;在所研制的核心芯片的基础上扩展成具备独立功能的控制器,为实现其多层共挤吹工艺装备的数控系统奠定基础。Aimed at the characteristics of high-performance intelligent multi-layer co-extrusion blow molding equipment in the packaging industry urgently in need,implementation method of key technologies for the equipment was proposed. The underlying sup-port algorithm,which is key part of the numerical control (NC)system,was researched. Through the test and analysis,the data show that this algorithm has the feasibility,reliability and efficiency. In order to improve the algorithm speed,the support algorithm was transformed into hardware algorithm implemented on the chip,based on optimization technology on chip-level. On basis of the core chip was developed,the controller was extended with independent functions. These have laid the basis to achieve NC system for multi-layer co-extrusion blow molding equipment.
分 类 号:TP29[自动化与计算机技术—检测技术与自动化装置]
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