化学镀镍-磷合金复合稳定剂的优化研究  

Optimizing research on Stabilizers of Electroless Ni-P Plating

作　　者：李雨[1] 刘定富[1] 

机构地区：[1]贵州大学,贵州贵阳550025

出　　处：《电镀与精饰》2014年第11期28-32,共5页Plating & Finishing

摘　　要：采用正交试验研究了稳定剂硫酸铜、碘酸钾、DL-半胱氨酸和硫酸铈复合使用对化学镀Ni-P合金镀液稳定性、镀速、镀层磷含量和孔隙率等性能的影响变化规律。结果表明,各种稳定剂之间有相互促进作用,综合性能明显优于单一稳定剂,且复合使用采用了清洁的原料,替代了重金属Pb2+;稳定剂硫酸铜、碘酸钾、DL-半胱氨酸和硫酸铈最佳复配的质量浓度分别为:25、20、3和7.5mg/L,镀后测得镀速12.54μm/h、镀液稳定常数91.85%、孔隙率0、镀层磷质量分数为10.25%。Influences of composite stabilizer（ composed by copper sulfate, potassium iodate, DL-cysteine and cerium sulfate）on electroless Ni-P plating stability, plating speed, phosphorus content of Ni-P coating and porosity rate were studied through orthogonal tests. Experimental results showed that： there were mutually reinforcing effects between single stabilizers, the overall performance of composite stabilizer was obviously better the that of single stabilizers. Further more, Pb^2＋ was replaced in composite stabilizer due to cleaner raw material was used. The optimum combination of stabilizers was ： copper sulfate 25 mg/L, potassium iodate 20 mg/L, DL-cysteine 3 mg/L,cerium sulfate 7.5 mg/L. Plating speed was 12.54 μm/h,bath stability constant was 91.85%, coating porosity rate was 0, and phosphorus mass fraction of the coating was 10.25%.

关 键 词：化学镀镍-磷合金 复合稳定剂 镀层性能 

分 类 号：TQ153.12[化学工程—电化学工业]