薄层铜包钢线钢芯的再结晶晶粒长大规律研究  

Research on Recrystallitation Grain Growth Behavior of Thin Layer Copper Clad Steel Wire

作　　者：李鸿娟[1] 丁志敏[1] 张浩[1] 高扬 高蕊 

机构地区：[1]大连交通大学材料科学与工程学院,辽宁大连116028 [2]傅氏国际(大连)双金属线缆有限公司,辽宁大连116100

出　　处：《热加工工艺》2014年第22期37-39,共3页Hot Working Technology

基　　金：国家自然学基金资助项目(5043202);国家973基金资助项目(2007CB607603)

摘　　要：采用金相分析法研究了薄层铜包钢线钢芯在不同退火温度及保温时间下再结晶及晶粒长大的规律,并在此基础上,对其晶粒生长动力学方程进行了数学回归分析。结果表明:随铜包钢退火温度升高,薄层铜包钢线钢芯组织经历回复-再结晶-晶粒长大的过程,即晶粒尺寸在这一过程中均呈现增加的趋势;晶粒长大动力学方程符合Beck方程,基于Beck方程以及普遍适用性的长大动力学方程进行数值回归分析,计算出再结晶晶粒长大激活能为42.66k J/mol。By metallographic analysis method, the rule of recrystallitation grain growth of thin layer copper clad steel at different annealing temperature and holding time was studied. On this basis, the grain growth kinetics equation was established by mathematics regression analysis. The results are as follows： with copper clad steel annealing temperature increasing, the steel＇s microstructure experiences the recrystallization-grain growth process of copper clad steel, namely the grain size increases in this process. The grain growth dynamics equation is conform to Beck equation. Based on Beck equation and universal applicative of grew up dynamic equation of mathematical regression analysis calculation, the recrystallization grain growth activation energy is 42.66 k J/mol.

关 键 词：薄层铜包钢线 回复再结晶 晶粒长大动力学 数值回归分析 激活能 

分 类 号：TG142.1[一般工业技术—材料科学与工程]