一种模组背板零件打鼓缺陷改善方法  

A method to improve wobbly defect on module back cover

作　　者：吴磊[1,2] 姚文平[3] 陈新平[1,2] 汪晨[1,2] 

机构地区：[1]宝山钢铁股份有限公司研究院,上海201900 [2]汽车用钢开发与应用技术国家重点实验室(宝钢),上海201900 [3]青岛海信电器股份有限公司,青岛266555

出　　处：《塑性工程学报》2014年第5期25-29,共5页Journal of Plasticity Engineering

摘　　要：模组背板是平板电视模组的重要结构件,用于支撑和固定模组,其尺寸精度直接影响模组的装配精度和使用特性,甚至对模组灯管等元器件造成损坏。文章在对模组背板打鼓缺陷的原因、影响因素进行分析的基础上,提出采用模态分析的方法改善模组背板打鼓缺陷,并通过实验,验证了该方法能有效改善零件的打鼓缺陷。Module back cover is one of the important components in panel TV ,and it was used to support and fix many compo-nents and parts . The dimension accuracy of the module back cover has great influence on assembly precision and operational per-formance .The influence factors and the reasons of wobbly defect on module back cover were studied in this paper ,and the modal analysis method was put forward to improve the wobbly defect . This method was proved effectively by the experiments of a typi-cal module back cover .

关 键 词：模组背板 冲压 模态分析 打鼓缺陷 

分 类 号：TB115[理学—数学]