多坯料挤压法制备近全致密W-Cu梯度热沉材料  

W-Cu functionally graded materials for heat sink with nearly full density fabricated by multi-billet extrusion method

作　　者：刘彬彬[1] 谢建新[2] 

机构地区：[1]湖南大学材料科学与工程学院,长沙410082 [2]北京科技大学材料科学与工程学院,北京100083

出　　处：《粉末冶金材料科学与工程》2014年第6期897-902,共6页Materials Science and Engineering of Powder Metallurgy

基　　金：国家杰出青年科学基金资助项目(50125415);湖南大学青年教师成长计划基金资助项目(531107040177)

摘　　要：采用多坯料挤压法制备封接层、中间过渡层和散热层分别为W/Cu20、W/Cu33和W/Cu50的近全致密均厚结构W-Cu梯度热沉材料,梯度层厚度均为0.5 mm,并对工艺过程、致密性能和显微结构进行研究。结果表明:采用多坯料挤压法制备W-Cu梯度预制块时压力仅为0.6 KN,经10 h自然干燥后,预制块外观平整,无开裂;在350℃脱脂1 h、然后在烧结温度1 060℃、压力85 MPa条件下,保温3 h可以获得各层相对密度分别为98.3%、99.3%、99.9%的近全致密的W-Cu均厚结构梯度热沉材料;各层间界面位置清晰,层间为冶金结合界面;各层中Cu相呈网状分布,W颗粒镶嵌于网络结构中。A three-layer W/Cu functionally graded material （FGM） for heat sink with nearly full density was fabricated by multi-billet extrusion （MBE） method. The compositions of the three layers including sealing layer, transitional layer and radiating layer of W/Cu heat sink material were W/Cu20, W/Cu33 and W/Cu50, respectively, and the thickness of each layer was 0.5mm. The fabrication process, densification and microstructure of W-Cu FGMs were also studied. The results show that the extrusion force of fabricating W-Cu graded billet by MBE method is about 0.6 KN; after natural dryness for 10 h, the specimens have no distortion or rupture; under the condition of degreasing temperature 350℃ for 1 h, sintering temperature 1 060℃ for 3 h with pressure 85 MPa, the W-Cu FGMs for heat sink with nearly full density and equal thickness can be obtained and the relative density of each graded layer is 98.3%, 99.3% and 99.9%, respectively. The interfaces between layers are visible. It is metallugical bonding between the layers. Cu phase shows network and W distributes in network structure.

关 键 词：多坯料挤压 梯度功能材料 W-Cu合金 相对密度 

分 类 号：TB331[一般工业技术—材料科学与工程]