军用膜集成电路市场及技术现状分析  

Status analysis on market and technologies of military film integrated circuit(FIC)

作　　者：谭士杰[1] 穆祯宗 

机构地区：[1]中国电子科技集团公司第九研究所,四川绵阳621000

出　　处：《磁性材料及器件》2014年第6期69-73,共5页Journal of Magnetic Materials and Devices

摘　　要：膜集成电路包括厚膜(LTCC)工艺集成电路、薄膜工艺集成电路,其与半导体集成电路一起有机地构成了混合集成电路(HIC),而后者是军事与宇航电子装备的重要组件、分系统甚至是系统。膜集成电路对军用电子装备的更新换代产生重大影响。简要介绍国内外军用膜集成电路的市场规模、应用领域及相关技术现状,分析了我军装备用膜集成电路与国外的差距,提出了发展膜集成电路的几点建议。Film integrated circuit （FIC） contains LTCC and thin film integrated circuit, constituting hybrid integrated circuit （HIC） along with semi-conduct integrated circuit （SIC）, which play as an important component, subsystem or even the whole system in military and aero electronic equipment. In the same time, FIC has a significant impact on the upgrading of military electronic equipment. This paper simply introduces the market scale, applied area and related technologies in the domestic and overseas, and analyzes the gap between our army and foreign armies. Also, it offers some proposals of the development on FIC.

关 键 词：厚/薄膜集成电路 军用市场 技术 应用 

分 类 号：TN44[电子电信—微电子学与固体电子学]