浅谈晶圆超薄化  

The Technics of Wafer Ultrathin

作　　者：杨文杰[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子工业专用设备》2014年第4期8-11,37,共5页Equipment for Electronic Products Manufacturing

摘　　要：主要简介了晶圆超薄化芯片减薄工艺的发展动态,讨论了现有设备基础上实现晶圆超薄化的局限性,提出了晶圆超薄化的工艺过程改进方案。T his article m ainly introduced the developm ent of ultra-thinning,the process and the characteristics of the ultrathin chip,and discussed the realization of ultra-thinning on the basis of the existing equipm ent,as w ell as the im provem ent of ultrathin process.

关 键 词：磨削减薄 损伤层 支撑系统 芯片强度 

分 类 号：TN305.1[电子电信—物理电子学]