基于Multi-stage的double stitch工艺在铜线焊中的应用  

Application of Double Stitch in Copper Wire Bonding Based on Multi-stage

作　　者：刘文峰[1] 齐立敏[1] 柳青[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2014年第9期26-31,共6页Equipment for Electronic Products Manufacturing

摘　　要：作为引线键合工艺中传统的焊接材料,金线在稳定性、导电性及价格等方面存在诸多局限,使得铜线焊技术在IC封装领域得到越来越广泛的应用。同时,由于铜线易氧化、硬度高,焊接能力较低,特别是二焊点容易出现拉力不够、开裂等缺陷,使得铜线焊的应用受到限制。针对传统工艺流程,提出Multi-stage方法,并在此基础上实现二焊点的double stitch工艺方法,通过试验证明该方法能够有效提高二焊点拉力,增强焊接强度。As the conventional bonding material,gold has been lim ited in advanced w ire packaging because of its stability,conductivity and the cost.As a result,the developm entand research of copper w ire is becom ing faster and faster in recentyears.Butatthe same time,the crack in 2nd bond ,such as low pullstrength and liftstitch are more likely to be observed in m anufacture due to itis oxidization ,high rigidity and the low bonding ability.This paper proposes a new double stitch m ethod based on Multi-stage,and then prove its superiority in increasing the pullstrength and bonding perform ance by the pulltestexperim ent.

关 键 词：铜线焊 分段式焊接(Multi-stage) 双鱼尾式焊点(Double stitch) 

分 类 号：TN305.94[电子电信—物理电子学]