铜和氧化铝瞬间液相连接用的AiNi微纳多层膜的特性(英文)  

Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al_2O_3 Ceramic

作　　者：易江龙[1,2] 张宇鹏[1,2] 胡海春[1,2,3] 王昕昕[1,2] 陈和兴[1,2] 代明江[1,2] 

机构地区：[1]中国-乌克兰巴顿焊接研究院广东省现代焊接技术重点实验室 [2]广州有色金属研究院,广东广州510651 [3]北京科技大学,北京100083

出　　处：《稀有金属材料与工程》2014年第11期2593-2596,共4页Rare Metal Materials and Engineering

基　　金：Pearl River Young Talents of Science and Technology in Guangzhou(2013J2200033);Guangdong Provincial Key Laboratory(2012A061400011);the Guangdong Innovative Research Team Program(201101C0104901263)

摘　　要：研究制备系列具有不同调制周期的Al-Ni多层膜,并将其应用于铜与氧化铝陶瓷件的TLP(transient-liquid-phase,瞬间液相)连接。分别对制备的系列多层膜及金属陶瓷接头微观组织进行表征,同时采用DSC及XRD对反应多层膜反应特性进行研究。研究结果表明,采用Al/Ni微纳尺度多层膜不仅可降低铜与氧化铝连接温度,并能提高焊接接头质量。A series of A1-Ni reactive multilayer with different modulation periods were fabricated by DC magnetron sputtering process, and transient-liquid-phase （TLP） bonding of copper and AI2O3 ceramic was carried out by the multilayer foils. The micro- structure of the as-deposited foils and the cermet joint were investigated. The reaction behaviors of A1/Ni multilayers were charac- terized by means of DSC and X-ray diffraction. The results show that the application ofA1/Ni multilayer foils not only decreases the joining temperature of the copper and AI2O3 ceramic, but also improves the quality of the joint.

关 键 词：Al-Ni微纳多层膜 瞬间液相连接 界面 氧化铝陶瓷 

分 类 号：TG49[金属学及工艺—焊接] TB43[一般工业技术]