纯钛微台阶精密连接技术  

Preparation of Ti Micro-Step with the Diffusion-Bonding Technique

作　　者：杨蒙生[1] 邢丕峰[1] 赵利平[1] 李朝阳[1] 高莎莎[1] 郑凤成[1] 易泰民[1] 马小军[1] 

机构地区：[1]中国工程物理研究院激光聚变研究中心,四川绵阳621900

出　　处：《稀有金属材料与工程》2014年第11期2758-2762,共5页Rare Metal Materials and Engineering

摘　　要：纯Ti微台阶为ICF研究中重要的基础靶型,由于物理实验的高度精密性,传统加工方法不能满足靶制备需求。研究了纯Ti微台阶的精密扩散焊接技术,获得高质量的标准台阶,其表面粗糙度Rq<100 nm、厚度一致性<100 nm、界面连续无显微缺陷、晶体结构均匀,未检测出杂质。The Ti standard micro-step is used in the experiments oflCF research as a basic target. For the precision of the experiment, there are strict criterions to the quality of targets and the matching is unfit. In this paper, the arts and crafts of the diffusion-bonding were researched. The parameters of the target such as the roughness, the thickness and the uniformity, the crystal structure and the interface were analyzed. Finally, the eligible Ti standard micro-step was prepared.

关 键 词：钛 微台阶 精密连接 

分 类 号：TG453.9[金属学及工艺—焊接]