无银无铅焊料用免清洗助焊剂研制  

Development of free-clean flux for silver and lead-free solder

作　　者：易江龙 张宇鹏 许磊 陈和兴 王昕昕 

机构地区：[1]广东省工业技术研究院广东省现代焊接技术重点实验室,中国-乌克兰巴顿焊接研究院,广东广州510651

出　　处：《电子元件与材料》2014年第12期74-77,共4页Electronic Components And Materials

基　　金：国家国际科技合作资助项目(No.2011DFB50190);广州市珠江科技新星专项资助项目(No.2013J2200033);广东省重点实验室建设资助项目(No.2012A061400011)

摘　　要：为了克服现有助焊剂在用于无银无铅焊料时存在的润湿性差、保护不良的缺点,通过对不同无卤素活性增强剂、复合溶剂的成分优化,结合绿色环保及无卤素的要求,设计合成了一种适用于Sn-0.7Cu-0.05Ni焊料用无卤素免洗助焊剂NHC-1,并对其主要性能进行测试。结果表明,NHC-1助焊剂润湿优良,焊点光亮,焊前及焊后对PCB板均无腐蚀性,满足IPC J-STD-004A的各项指标要求。In order to improve the properties of the exist flux for the silver and lead-free solder, through composition optimizations of halogen-free active-agents and solvents, combined with environmental protection and halogen-free requirements, the free-clean flux NHC-1 for the silver and lead-free solder Sn-0.7Cu-0.05 Ni was designed and synthesized.Its main properties were tested. The results show that NHC-1 flux has excellent wetting ability, bright solder joints and no corrosion to PCB. All performances meet the requirements of the standard IPC J-STD-004 A.

关 键 词：免洗助焊剂 Sn-Cu-Ni 无卤素 无银无铅焊料 腐蚀性 溶剂 

分 类 号：TG42[金属学及工艺—焊接]