邻甲基苯胺改性双氰胺环氧固化剂的合成及性能研究  

Synthesis and properties of dicyandiamide curing agent modified with o-toluidine for epoxy resin

作　　者：程秀莲[1] 孙丰雅 霸书红[1] 

机构地区：[1]沈阳理工大学装备工程学院,辽宁沈阳110159

出　　处：《粘接》2014年第12期60-63,共4页Adhesion

摘　　要：用邻甲基苯胺对双氰胺进行改性,制备了一种新型的改性双氰胺固化剂。对合成条件进行优化,并对其固化条件进行了研究。结果表明,邻甲基苯胺改性双氰胺的较佳工艺条件为:邻甲苯胺与盐酸的物质的量比为1∶1.1,邻甲苯胺与双氰胺的物质的量比为1∶1.4,于90℃反应3.5 h,收率为87.01%,原料利用率为74.74%。通过测试涂层硬度来考查固化工艺与性能。结果表明,作为环氧树脂固化剂单独使用时,质量比1∶10,固化温度为130℃,HV1=35.98比双氰胺体系固化温度降低了30℃。A novel curing agent,o-toluidine modified dicyandiamide was prepared. The optimum synthesis conditions and the curing properties were studied. The results showed that the better synthesis conditions are as follows： the mole ratio of o-toluidine to hydrochloric acid is 1：1.1, the mole ratio of dicyandiamide to o-toluidine is 1.4：1, the reaction temperature and time are 90℃ and 3.5 h respectively and the yield of o-toluidine modified dicyandiamide is up to 87.01% and the utilization of raw materials is up to 74.74%.The curing process and the properties of cured were investigated using the hardness tests of the epoxy resin.The results showed that when dicyandiamide modified by o-toluidine is used as the curing agent, the weight ratio of curing agent to epoxy resin is one to ten and the curing temperature is 130℃,the HV1 value is 35.98 which is 30℃ lower than that of alone dicyandiamide system.

关 键 词：邻甲基苯胺 双氰胺 环氧树脂 硬度 

分 类 号：TQ433.437[化学工程]