低温酰亚胺化法制备聚酰亚胺的研究进展  

Progress on the preparation of low-temperature cured polyimide

作　　者：赵安鲁 徐勇[1] 王新龙[1] 

机构地区：[1]南京理工大学化工学院,南京210000

出　　处：《化工新型材料》2014年第12期22-24,34,共4页New Chemical Materials

基　　金：江苏高校优势学科建设工程资助项目

摘　　要：聚酰亚胺(PI)以其优异的性能在电子领域得到了广泛的应用,但其高温酰亚胺化过程给聚酰亚胺的应用带来很大限制。综述了在低温条件下使PI完成酰亚胺化的3种方法,重点介绍了催化酰亚胺化过程中催化剂的选择。并概述了低温酰亚胺化法制备PI在液晶显示取向剂、非线性光学材料、半导体封装材料和柔性覆铜板的制造等领域的应用。Polyimides have attracted wide interest by the electronics industry because of their excellent properties.To fully imidize PAAs thermally,it is necessary to heat them at high temperature.As a result,there are some limitations to the application of polyimides in the electronics industry.A review on three methods of the preparation of low-temperature cured polyimides was introduced.The selection of curing catalysts was mainly introduced,and the application of polyimides in the electronics industry was also introduced.

关 键 词：聚酰亚胺 低温酰亚胺化 催化剂 

分 类 号：O633.22[理学—高分子化学]