对有核与无核多层基板的供电网络分析  

Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package

作　　者：Ozgur Misman Mike DeVita Nozad Karim 

机构地区：[1]安靠封装测试

出　　处：《中国集成电路》2014年第12期77-81,88,共6页China lntegrated Circuit

摘　　要：由于具有高密度布线能力和相对合理的成本,在特殊用途集成电路(ASI Cs)的倒装封装中使用叠积层式(bui l d-up)有机基板非常受欢迎。典型的叠积层式基板包括核层和其双侧的高密度布线层(叠积层)。核层为封装提供所需刚度,其厚度可以是400μm,600μm,或800μm。新兴的无核基板技术去除了核层,可以提高布线密度,减薄封装,和获得更好的电气性能。本文比较了8层有核与无核基板在31mm和900锡球封装中的核心供电网络(PDN)的性能。在50MHz到2GHz频域内,我们用矢量网络分析仪测得两路高频S参数以分析相应的PDN。测量与模拟结果十分吻合。另外,我们还在时域内模拟计算了PDN对瞬变电流的响应。The use of flip chip organic buildup substrates is a popular choice for large Application Specific Integrated Circuits （ ASICs ） due to the high routing density they offer at a relatively reasonable cost. A typical buildup package consists of multiple high density routing layers （ buildup layers ） supported by a thick core. The laminate core adds rigidity to the substrate and can be configured to various thicknesses such as 400 μm, 600 μm and 800 μm. Coreless substrates are an emerging technology targeted to increase the routing density, lower the package z height, while providing better electrical performance. This is primarily due to the replacement of thick core layers with a thin buildup layer. As the trend for higher levels of performance and system bandwidth continues, coreless technology is well positioned as an enabling technology solution. In this paper we compare the performance of the core power delivery network （ Core-PDN ） of two 31mm, 900 ball, 8 layer organic flip chip buildup substrates. We first analyze the substrates in the frequency domain and then evaluate the transient response under various switching conditions. Both packages are designed identically except for the core versus careless substrale construction. Two-port high frequency S parameter measurements between 50MHz and 2GHz are carried out using a Vector Network Analyzer （ VNA ） to characterize the PDN in the frequency domain. Both simulaled and measured data are correlated in the frequency domain. Time domain response of PDN to current transients with various switching conditions are simulated and presented.

关 键 词：供电网络 无核基板 倒装封装 叠积层式基板 电气性能 

分 类 号：TM711[电气工程—电力系统及自动化]