SAC105掺Ni焊球对焊接点强度与可靠性的影响  

Effects of SAC105 Ni Doping Solder Ball on the Strength and Reliability of the Solder Joint

作　　者：张淑红[1] 陶自春 

机构地区：[1]苏州工业职业技术学院机电工程系,江苏苏州215104 [2]快捷半导体苏州有限公司,江苏苏州215021

出　　处：《半导体技术》2015年第1期58-62,共5页Semiconductor Technology

基　　金：苏州市科技计划资助项目(SYG201347)

摘　　要：在内存封装领域,球栅阵列封装(BGA)由于具有高密度和低成本的特点而被广泛采用。在实际的使用过程中,由于遭受外界各种形式的机械负载和冲击造成器件失效,为了改善焊点的强度和可靠性,以SAC105(Sn98.5Ag Cu0.5)无铅焊球为参照制备出SAC105 Ni0.05焊球。为了研究两种焊球焊接点的可靠性与强度,采用焊球的快速剪切测试以及BGA器件的剪切测试方法来检测焊点强度,同时采用威布尔分析方法对两种焊球的热循环测试(TCT)结果进行分析。研究表明,SAC105 Ni0.05焊球比SAC105焊球具有更长的温度循环可靠性预期寿命、更强的焊接点强度以及更低的脆性断裂的概率。Ball grid array （BGA） package is applied in memory products because of the high densi- ty package and the low cost. In the actual use of the process, many failures caused by the mechanical load and shock were detected. To improve the strength and the reliability of the solder joint, the SAC105 Ni0.05 solder ball was prepared based on SAC 105 （Sn98.5AgCu0. 5 ） lead-free solder ball. To investigate the reliability and the strength of both solder joints, solder joint strength was detected by the fast ball shear test and shear test of BGA devices. The thermal cycle test results of both solder ball were analyzed by the Weilbull analysis method. The researches show that the solder joint of SAC105 Ni0. 05 has longer temperature cycle reliability life expectancy, more robust solder joint and lower possibility of the IMC crack than SAC 105 solder ball.

关 键 词：金属间化合物(IMC) 基板 印刷电路板(PCB) 焊接点 威布尔分布 球栅阵列(BGA) 

分 类 号：TN405[电子电信—微电子学与固体电子学]